Solution Approach
RawSource supplies the base chemicals that go into these programs. We can help with product selection, grade matching, and sourcing from multiple origins for supply security.
Typical Selection Workflow
1
Process & Requirement Definition
Map the unit operation and define the functional, purity, and regulatory requirements the chemical input must meet.
2
Chemistry & Grade Selection
Match the solvent, intermediate, acid or base, catalyst, or specialty additive to the process and downstream compatibility.
3
Trial & Specification
Validate performance at bench or pilot scale, and set the grade, treat rate, and packaging to match throughput and handling.
4
Quality & Supply Assurance
Lock the spec with a CoA and secure multi-origin sourcing for supply resilience and consistent lot quality.
Recommended Chemistries (7)
Bisphenol A diglycidyl ether (DGEBA) epoxy resin
CAS 25068-38-6
Specialty Additives
Standard liquid epoxy resin
Standard liquid epoxy resin - difunctional glycidyl ether that crosslinks with amine hardeners into rigid, chemically resistant adhesive/coating films
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Bisphenol A
CAS 80-05-7
Polymers & Resins
Primary raw material for epoxy resins
Aromatic diol building block reacted with epichlorohydrin to make DGEBA epoxy resins; raw material feedstock
Melting Point: 153–156 °C Boiling Point: 220 °C at 4 mmHg Density: 1.195 at 25 °C
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Bisphenol F diglycidyl ether (DGEBF) epoxy resin
CAS 9003-36-5
Specialty Additives
Crosslinking / Curing
Difunctional bis-glycidyl ether of bisphenol F (the bisphenol-F analog of DGEBA, not a phenol-novolac epoxy). Its lower viscosity and improved solvent/chemical resistance suit high-solids and chemically resistant adhesives and coatings
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Tetraethylenepentamine
CAS 112-57-2
Amines & Amides
Crosslinking / Curing
2320 (TETRAETHYLENEPENTAMINE) · Class Multifunctional polyamine hardener whose five reactive N-H sites open epoxy rings to build the cured network at ambient temperature
Melting Point: -40 °C Boiling Point: 340 °C at 760 mmHg Density: 0.998 at 20 °C
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Polyetheramine D-230
Difunctional polyether-amine curative giving epoxy systems flexibility and long pot life for adhesives and composites. (Listed by exact spine name; the spine carries no CAS for this grade, so none is asserted.)
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Methylene diphenyl diisocyanate (MDI)
CAS 101-68-8
Specialty Additives
Crosslinking / Curing
2206 (DIPHENYLMETHANE-4,4'-DIISOCYANATE) · Class Aromatic diisocyanate that reacts with polyols to form the urethane network in PU adhesives/sealants and elastomers
Physical Description: Diphenylmethane-4,4-diisocyanate is a light yel… Appearance: White to light yellow flakes Odor: Odorless
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Toluene diisocyanate (TDI)
CAS 26471-62-5
Specialty Additives
Crosslinking / Curing
Reactive aromatic diisocyanate for flexible PU foams and elastomer prepolymers
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