Why It Matters
Adhesive and sealant formulation needs epoxy resins, amine curatives and polyurethane raw materials (isocyanates/polyols)
Solution Approach
Adhesive and sealant formulation needs epoxy resins, amine curatives and polyurethane raw materials (isocyanates/polyols) RawSource supplies the base chemicals that go into these programs. We can help with product selection, grade matching, and sourcing from multiple origins for supply security.
Typical Treatment Workflow
1
System Assessment
Characterize operating conditions—fluid composition, temperature, pressure, flow rates—and benchmark current treatment performance.
2
Chemistry Selection
Match base chemicals to your operating envelope. Factor in compatibility with existing programs, regulatory constraints, and downstream impacts.
3
Dosage & Delivery
Determine optimal treat rates through jar testing or field trials. Configure packaging (drums, totes, ISO tanks) to match consumption and storage logistics.
4
Monitoring & Adjustment
Track KPIs—coupon rates, residuals, separator performance, water quality. Adjust chemistry and dosage as conditions change.
Recommended Chemistries (7)
Bisphenol A diglycidyl ether (DGEBA) epoxy resin
CAS 25068-38-6
Specialty Additives
Standard liquid epoxy resin
Standard liquid epoxy resin - difunctional glycidyl ether that crosslinks with amine hardeners into rigid, chemically resistant adhesive/coating films
Full Details
Bisphenol A
CAS 80-05-7
Polymers & Resins
Primary raw material for epoxy resins
Aromatic diol building block reacted with epichlorohydrin to make DGEBA epoxy resins; raw material feedstock
Melting Point: 153–156 °C Boiling Point: 220 °C at 4 mmHg Density: 1.195 at 25 °C
Full Details
Bisphenol F diglycidyl ether (DGEBF) epoxy resin
CAS 9003-36-5
Specialty Additives
Crosslinking / Curing
Difunctional bis-glycidyl ether of bisphenol F (the bisphenol-F analog of DGEBA, not a phenol-novolac epoxy). Its lower viscosity and improved solvent/chemical resistance suit high-solids and chemically resistant adhesives and coatings
Full Details
Tetraethylenepentamine
CAS 112-57-2
Amines & Amides
Crosslinking / Curing
2320 (TETRAETHYLENEPENTAMINE) · Class Multifunctional polyamine hardener whose five reactive N-H sites open epoxy rings to build the cured network at ambient temperature
Melting Point: -40 °C Boiling Point: 340 °C at 760 mmHg Density: 0.998 at 20 °C
Full Details
Polyetheramine D-230
Difunctional polyether-amine curative giving epoxy systems flexibility and long pot life for adhesives and composites. (Listed by exact spine name; the spine carries no CAS for this grade, so none is asserted.)
Full Details
Methylene diphenyl diisocyanate (MDI)
CAS 101-68-8
Specialty Additives
Crosslinking / Curing
2206 (DIPHENYLMETHANE-4,4'-DIISOCYANATE) · Class Aromatic diisocyanate that reacts with polyols to form the urethane network in PU adhesives/sealants and elastomers
Physical Description: Diphenylmethane-4,4-diisocyanate is a light yel… Appearance: White to light yellow flakes Odor: Odorless
Full Details
Toluene diisocyanate (TDI)
CAS 26471-62-5
Specialty Additives
Crosslinking / Curing
Reactive aromatic diisocyanate for flexible PU foams and elastomer prepolymers
Full Details