Industrial Manufacturing / Solution Family

Epoxy & Resin Intermediates

Reactive building blocks for thermoset adhesives, coatings, and composites u2014 bisphenol A, DGEBA liquid epoxy resin, and ethylene glycol resin intermediate u2014 supplied for bulk formulation.

Overview

Epoxy and resin intermediates are the reactive building blocks thatnformulators convert into thermoset adhesives, sealants, coatings, and compositenmatrices. The core pair is bisphenol A (BPA, CAS 80-05-7) and the liquidnepoxy resin it forms, bisphenol A diglycidyl ether (DGEBA, CAS 25068-38-6): BPAnreacts with epichlorohydrin to make DGEBA, which then cures with an amine ornanhydride hardener into a crosslinked network. Specify DGEBA grade by epoxynequivalent weight (EEW) so it matches your hardener stoichiometry.

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DGEBA is the workhorse liquid epoxy; standard grades run an EEW near 182-192 g/eq,nwhich sets how much hardener each batch needs. The genuine trade-off sits with BPAnitself. It delivers the rigidity, adhesion, and chemical resistance epoxy buyersnexpect, but it carries regulatory scrutiny that bio-based or novolac alternatives donnot. Where that scrutiny matters for your end use, qualify an alternative early; wherenperformance and cost rule, BPA-based DGEBA stays the default. Confirm regulatorynstatus for your application and jurisdiction.

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Ethylene glycol (CAS 107-21-1) is the polyester-resin and glycol intermediate innthis group, not an epoxy reactant. It serves as a diol for unsaturated polyester andnalkyd resins and as the base for heat-transfer and antifreeze fluids. Buyers oftennsource it alongside epoxy feedstocks for the same adhesive, composite, or process-fluidnprograms. Match grade to the end use rather than defaulting to one specification.

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Where it's used
  • Two-part epoxy adhesives and structural bonding systems (DGEBA plus amine hardener)
  • Protective and industrial-maintenance coatings needing chemical and abrasion resistance
  • Fiber-reinforced composite matrices for tooling, laminates, and repair
  • Unsaturated polyester and alkyd resins using ethylene glycol as the diol
  • Electrical potting, encapsulation, and casting resins
Frequently asked questions
Does RawSource supply bisphenol A and DGEBA epoxy resin in bulk?
Yes. RawSource sources bisphenol A, DGEBA liquid epoxy resin, and ethylene glycol for bulk formulation, configured in drums, totes, and larger volumes against an RFQ. CAS numbers and grade requirements are matched at quote.
What is the difference between bisphenol A and DGEBA?
Bisphenol A (CAS 80-05-7) is the precursor monomer. DGEBA (CAS 25068-38-6) is the curable liquid epoxy resin made by reacting bisphenol A with epichlorohydrin. You cure DGEBA with an amine or anhydride hardener; bisphenol A on its own does not cure into an epoxy network.
How do I select a DGEBA grade?
Select by epoxy equivalent weight (EEW). Standard liquid grades run near 182-192 g/eq, and EEW determines how much hardener a batch needs for full cure. A lower EEW means more reactive epoxy sites per gram, which raises crosslink density and rigidity.
Is ethylene glycol an epoxy intermediate?
No. Ethylene glycol (CAS 107-21-1) is a polyester-resin diol and the base for antifreeze and heat-transfer fluids, not an epoxy reactant. It is supplied in this family because buyers source it alongside epoxy feedstocks for the same adhesive and composite programs.
Disclaimer. Information on this page is provided for general reference and compiled from authoritative public sources (e.g. PubChem/ECHA). Values are typical and are not a guaranteed specification; the Certificate of Analysis (CoA) for the lot you purchase governs. Products are sold for industrial and professional use only. Nothing here is a medical, health, or efficacy claim. Always consult the current Safety Data Sheet (SDS) before handling, and confirm regulatory status, classification, and suitability for your application and jurisdiction.
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