Why It Matters
Electronics manufacturers protect PCBs from moisture, dust and vibration with conformal coatings and potting/encapsulation resins, sourcing both finished systems and raw materials. We already hold much of the raw-material spine in epoxy, silicone fluids and silanes
Solution Approach
Electronics manufacturers protect PCBs from moisture, dust and vibration with conformal coatings and potting/encapsulation resins, sourcing both finished systems and raw materials. We already hold much of the raw-material spine in epoxy, silicone fluids and silanes RawSource supplies the base chemicals that go into these programs. We can help with product selection, grade matching, and sourcing from multiple origins for supply security.
Typical Selection Workflow
1
Process & Requirement Definition
Map the unit operation and define the functional, purity, and regulatory requirements the chemical input must meet.
2
Chemistry & Grade Selection
Match the solvent, intermediate, acid or base, catalyst, or specialty additive to the process and downstream compatibility.
3
Trial & Specification
Validate performance at bench or pilot scale, and set the grade, treat rate, and packaging to match throughput and handling.
4
Quality & Supply Assurance
Lock the spec with a CoA and secure multi-origin sourcing for supply resilience and consistent lot quality.
Recommended Chemistries (4)
Bisphenol A diglycidyl ether (DGEBA) epoxy resin
CAS 25068-38-6
Specialty Additives
Standard liquid epoxy resin
Epoxy backbone for rigid potting/encapsulation that cures with amine/anhydride hardeners to seal PCBs against moisture and vibration; in catalog
Full Details
Silanol-terminated PDMS
CAS 70131-67-8
Silicone Fluids & Oils
High-viscosity silicone compound
Base polymer for RTV silicone encapsulant that condensation-cures to a flexible, moisture-resistant gel or rubber
Full Details
Vinyltrimethoxysilane
CAS 2768-02-7
Silanes & Organosilanes
Vinyl silane for polyethylene crosslinking
Silane crosslinker and adhesion promoter for moisture-cure silicone encapsulant systems; in catalog
Melting Point: ˆ'97°C Boiling Point: 123°C at 1013 hPa (converted to 101.3 kPa) (760… Density: Specific Density: 0.94 (water = 1)
Full Details
Polyether polyol + isocyanate (PU encapsulant)
Reacts to a tough urethane potting compound providing vibration damping and chemical resistance
Full Details
Related Product Families
● Available
Silicone Defoamers & Antifoams
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Epoxy & Resin Intermediates
Bisphenol A, DGEBA resins, and reactive intermediates for adhesive, sealant, and composite formulation
Film FormationCrosslinking
8 chemistries
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● Available
Silane Coupling Agents
Amino, epoxy, vinyl, and mercapto silanes for adhesion promotion in composites, coatings, and sealants
Adhesion PromotionCoupling
15 chemistries
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