エポキシ・樹脂中間体

エポキシ中間体は、2液型エポキシ系を構成するモノマーおよびベース樹脂です。 Bisphenol A (BPA) and bisphenol F (BPF) are the aromatic diol precursors; reacting them with epichlorohydrin yields the diglycidyl ethers (DGEBA from BPA) that carry the reactive epoxide rings. Those rings later open against an amine or anhydride curative to form the crosslinked thermoset. In short, these are the resin side of an epoxy formulation, not the hardener.

Standard liquid DGEBA resin runs roughly 11,000-15,000 cP at 25 C, stiff enough that many formulators thin it. Bisphenol F resin is the honest trade-off: its lower viscosity, around 3,000-5,000 cP, improves filler wet-out and chemical resistance, but it costs more per kilogram than BPA-based resin. Specify BPF where flow or solvent resistance is the binding constraint; specify BPA-based DGEBA for general-purpose, cost-driven work.

Bisphenol A is on the ECHA SVHC Candidate List, so downstream documentation and jurisdictional limits matter for any BPA-bearing resin. The curative, reactive diluents, and fillers shift pot life, glass-transition temperature, and final hardness more than the base resin alone does. Match the resin grade to the curative chemistry first, then adjust viscosity with diluents. Confirm regulatory status for your application and jurisdiction.

• 2液型構造用エポキシ接着剤および積層用樹脂
• マリン、輸送機器、産業部品向けの繊維強化複合材料（ガラス繊維、炭素繊維）
• 耐薬品性が求められる重防食およびタンクライニング用エポキシ塗料
• 電気部品の封止、ポッティング、注型用コンパウンド
• 低粘度BPFが濡れ性を助けるツーリング、床材、グラウト系

• Bisphenol A u2014 PubChem
• Bisphenol F u2014 PubChem
• DGEBA epoxy resin — PubChem