에폭시 및 수지 중간체

에폭시 중간체는 2액형 에폭시 시스템을 구성하는 모노머와 베이스 수지입니다. Bisphenol A (BPA) and bisphenol F (BPF) are the aromatic diol precursors; reacting them with epichlorohydrin yields the diglycidyl ethers (DGEBA from BPA) that carry the reactive epoxide rings. Those rings later open against an amine or anhydride curative to form the crosslinked thermoset. In short, these are the resin side of an epoxy formulation, not the hardener.

Standard liquid DGEBA resin runs roughly 11,000-15,000 cP at 25 C, stiff enough that many formulators thin it. Bisphenol F resin is the honest trade-off: its lower viscosity, around 3,000-5,000 cP, improves filler wet-out and chemical resistance, but it costs more per kilogram than BPA-based resin. Specify BPF where flow or solvent resistance is the binding constraint; specify BPA-based DGEBA for general-purpose, cost-driven work.

Bisphenol A is on the ECHA SVHC Candidate List, so downstream documentation and jurisdictional limits matter for any BPA-bearing resin. The curative, reactive diluents, and fillers shift pot life, glass-transition temperature, and final hardness more than the base resin alone does. Match the resin grade to the curative chemistry first, then adjust viscosity with diluents. Confirm regulatory status for your application and jurisdiction.

• 2액형 구조용 에폭시 접착제 및 라미네이팅 수지
• 선박, 운송, 산업용 부품을 위한 섬유강화 복합재(유리, 카본)
• 내약품성이 요구되는 방식 및 탱크 라이닝 에폭시 도료
• 전기 절연 봉지, 포팅, 캐스팅 컴파운드
• 저점도 BPF가 함침성을 높여 주는 툴링, 바닥재, 그라우트 시스템

• Bisphenol A — PubChem
• Bisphenol F — PubChem
• DGEBA epoxy resin — PubChem