Approche de solution
RawSource supplies the base chemicals that go into these programs. We can help with product selection, grade matching, and sourcing from multiple origins for supply security.
Typical Formulation Workflow
1
System & Substrate Assessment
Define the binder system (waterborne, solventborne, UV, powder), substrate, cure, and the VOC, durability, and appearance targets.
2
Additive & Resin Selection
Match resins, pigments and fillers, dispersants, rheology modifiers, defoamers, or biocides to the formulation and compatibility window.
3
Lab Let-Down & Optimization
Dial in loading and addition order through lab let-downs, checking dispersion, rheology, film properties, and storage stability.
4
Application & Performance Testing
Validate on the real application method and substrate, tracking gloss, adhesion, sag, cure, and weathering before scale-up.
Recommended Chemistries (5)
Bisphenol A diglycidyl ether (DGEBA) epoxy resin
CAS 25068-38-6
Additifs de Spécialité
Formation de film
Backbone resin whose epoxide groups crosslink with amine hardeners into a hard, chemical-resistant film for self-leveling floors
Aperçu rapide
Détails complets
Isophorone diamine (IPDA)
CAS 2855-13-2
Amines et Amides
Industry standard for clear, chemical-resistant coatings
2289 (ISOPHORONEDIAMINE) · Class Cycloaliphatic diamine hardener giving high crosslink density, good color retention and chemical resistance for floor topcoats
Physical Description: Isophoronediamine appears as a clear to light-y… Appearance: Colorless liquid Odor: Characteristic odor
Aperçu rapide
Détails complets
Polyetheramine D-230
CAS 9046-10-0
Flexible polyoxypropylene diamine that lengthens pot life and adds toughness/impact resistance to broadcast and self-leveling floors
Aperçu rapide
Détails complets
C12-C14 alkyl glycidyl ether (reactive diluent)
CAS 68609-97-2
Additifs de Spécialité
Réticulation / Durcissement
Mono-functional epoxide diluent that drops viscosity for trowel/roller application without adding VOC
Aperçu rapide
Détails complets
Mannich-base fast-cure curing agent
Phenol-aldehyde-amine adduct that cures at low temperature and high humidity for fast-return industrial floors